[News] NVIDIA Unveils Next-Gen CPO Prototype With Optics on Silicon Interposer, Targets Higher Bandwidth Density

NVIDIA is advancing its next-generation co-packaged optics (CPO) technology, with prototypes designed to bring optical engines closer to computing chips. According to Wccftech, the company presented its latest optical integration research at SEMICON West 2026 under the theme “Optical Integration for the Next Generation of AI,” including an optics-on-interposer (OOI) prototype and dense wavelength-division multiplexing (DWDM) technology. The OOI design moves optical engines from the organic package substrate directly onto the silicon inter...