EUV
共 15 篇 · 来自全球主要半导体媒体、研究机构与公司公告
Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume
By Shaurya Seth Terafab is one of the most ambitious projects of the decade: $16.8 billion for phase one and up to $119 billion across four phases. A …
10-16 21:00
Siemens and NVIDIA speed up AI chip lithography by 12x
Siemens has expanded its collaboration with NVIDIA to accelerate computational lithography for next-generation AI chips, delivering up to 12x faster f…
10-16 19:45
Chip Industry Week In Review
Fab expansion accelerates; China advances memory and EUV; Teradyne's test deal; SEMICON West and OCP highlights; 3D SiP; TSMC and ASML signals; 300mm …
10-16 15:01
ZEISS SMT Expands from Lithography Optics into Advanced Packaging Process Control
DUNE corrects wafer bow one wafer at a time, NLX brings X-ray inline, and mask tools get ready for High-NA's larger reticles The post ZEISS SMT Expand…
10-15 23:41
HEIDENHAIN Brings Front-End Motion Control Precision to Advanced Packaging
New ETEL METIS HP air bearing stage uses multi-degree-of-freedom encoders to target maskless lithography and inspection on large panels The post HEIDE…
10-15 23:38
Mitsubishi Chemical Group: The Materials Supplier Hiding Inside the Tool
From engineering plastics in semiconductor wafer equipment to EUV dry resist precursors, MCG says its vertically integrated portfolio touches nearly e…
10-15 22:10
IBM and Siemens team up to advance 3D nanostack chip technology
IBM and Siemens have announced a research collaboration to advance IBM’s 3D nanostack transistor architecture, targeting the design and manufacturing …
10-15 14:24
ASML hits record €11.7 billion sales as AI chip demand surges
ASML reported record third-quarter 2026 sales of €11.7 billion ($13.6 billion), up 25% from the previous quarter, as growing demand for AI chips conti…
10-15 13:49
Siemens, NVIDIA Accelerate Computational Lithography Up to 12×
Siemens today announced significant advances in its collaboration with NVIDIA to accelerate computational lithography workflows. The post Siemens, NVI…
10-15 03:45
Fortastra spacecraft programme gains $30m in Series A
US space technology startup Fortastra has raised US$30 million in Series A funding to develop manoeuvrable spacecraft designed to protect satellites a…
10-14 20:12
ASML considers further capacity expansion beyond existing growth plans
ASML is exploring how to increase its production capacity from 2028 beyond previously announced plans.
10-14 13:18
Nikon Unveils Digital Lithography System for Advanced Semiconductor Packaging
Nikon Corporation will release the DSP-110 digital lithography system for semiconductor advanced packaging in April 2027. The post Nikon Unveils Digit…
10-14 01:38
Outsourcing wafer handler to VDL ETG fails, ASML takes back full control
Around 2012, key supplier VDL ETG assumed full product responsibility for ASML’s wafer handler. The mission failed.
10-13 11:08
Less spreadsheets, more courage
VDL ETG was capable of pulling off the wafer handler job for ASML, but the willingness to invest simply wasn’t there.
10-13 11:00
Samsung Electronics and ASML Expand Strategic Collaboration for Next-Generation Semiconductor Manufacturing
Samsung Electronics and ASML today announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithogr…
09-08 23:03