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共 692 篇 · 来自全球主要半导体媒体、研究机构与公司公告

Micron Plans to Invest Up to $50 Million to Support Genesis Mission Graduate Fellowship and National Laboratory Research

Announced at the White House “Science: A New Golden Age Summit,” investment will develop next generation of U.S. scientists and engineers in advanced …

Semiconductor Digest IntelMicron
2026-10-09
10-09 04:38

Bluetooth Gets Ultra-Low Latency and Higher Throughput

New Bluetooth human interface device standards add new features.

Electronic Design
2026-10-09
10-09 04:06

Principal RF Design Engineer

About UsTagoreTech is developing disruptive high-power RF technology for next-generation communication systems. We are a fabless semiconductor company…

Tagore Technology 汽车电子
2026-10-09
10-09 02:42

The Missing Handoff Between Schematic Generation and PCB Layout Automation

The gap between schematic generation and PCB layout reveals a larger problem: Hardware design is still organized as a serial workflow when AI agents c…

Electronic Design
2026-10-09
10-09 02:34

A Blueprint for Inverting Buck-Boost Compensation

Designing a voltage-loop compensator is critical for buck-boost converters that generate negative voltage rails.

Electronic Design
2026-10-09
10-09 00:51

Samsung Electronics Announces Earnings Guidance for Third Quarter 2026

Samsung Electronics today announced its earnings guidance for the third quarter of 2026. · Consolidated Sales: Approximately 195 trillion Korean won ·…

Samsung Newsroom 财报 Samsung
2026-10-08
10-08 15:49

Wolfspeed Secures Conditional $1.5B U.S. Commitment for Domestic SiC Production

Represents another significant step in Wolfspeed’s long-term financing and plan to strengthen its domestic wide bandgap semiconductor technology platf…

Semiconductor Digest 汽车电子
2026-10-08
10-08 05:12

Aehr Expands AI Chip Burn-In Capacity with $6M Hyperscaler Order

Aehr Test Systems, a provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data ce…

Semiconductor Digest AI芯片汽车电子 Intel
2026-10-08
10-08 05:04

MintNeuro Raises $5M to Scale Purpose-Built Chip Platform for Neural Devices and Brain-Computer Interfaces

Funding from European and US investors will accelerate product launch, partner adoption and international expansion. The post MintNeuro Raises $5M to …

Semiconductor Digest
2026-10-08
10-08 03:20

eFuse Offers Resistor-Adjustable Current Limit, Multiple Protection Features

This tiny 75-V eFuse from Toshiba has adjustable current limit to 6 A along with user-settable capabilities.

Electronic Design
2026-10-08
10-08 03:10

The U.S. Just Bet $1 Billion on Quantum Chip Manufacturing

The U.S. Department of Commerce has finalized a CHIPS and Science Act R&D award of up to $1 billion for Anderon, a quantum foundry IBM established ear…

IEEE Spectrum · Semiconductors Intel
2026-10-07
10-07 21:09

Reducing Fab Cycle Time: What MES, Dispatching, Scheduling and APC Each Contribute

Dispatching, finite-capacity scheduling, MES, APC and simulation each attack a different share of the time wafers spend waiting, and all of them depen…

Semiconductor Digest
2026-10-07
10-07 20:55

PerFET™ 60V Power MOSFETs for Automotive

Taiwan Semiconductor introduces its PerFET™ 60V MOSFET technology in PDFN56U (5mm × 6mm) single and dual packages for automotive applications requirin…

台湾半导体 汽车电子
2026-10-07
10-07 11:27

Qnity Develops 330°C Sealing Material for High-Temperature Chipmaking Processes

New Kalrez 7080 sealing solution strengthens an integrated portfolio of technologies designed to improve yield, reliability, and tool performance. The…

Semiconductor Digest
2026-10-07
10-07 02:41

GlobalFoundries to Industrialize Xanadu Quantum-Photonic Components on 300mm Line

This partnership combines Xanadu’s existing expertise in ultra-low loss photonic design and process development with GF’s industry-leading photonics m…

Semiconductor Digest
2026-10-07
10-07 02:33

Applied Materials, Intel Deepen R&D Collaboration on Transistor Scaling and Advanced Packaging

The collaboration will bring together cutting-edge capabilities from Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oreg…

Semiconductor Digest 封装 IntelApplied Materials
2026-10-07
10-07 02:29

Teradyne Integrates Burn-In and System-Level Test for High-Power AI Chips

Chipmakers can lower cost of test, factory floor space, and time to market for high-power AI, automotive, and other high-reliability devices. The post…

Semiconductor Digest AI芯片汽车电子
2026-10-07
10-07 02:24

Renesas Moves GaN Into 100 V Power Applications for AI Data Centers and Robotics

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has expanded its GaN portfolio into low-voltage applications with its…

Semiconductor Digest 机器人
2026-10-07
10-07 02:15