Credit: AFP
Paras Semiconductors teams with US-based BroadPak on advanced packaging plant in India
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英文
Paras Semiconductors, a subsidiary of Indian defense company Paras Defence & Space Technologies, announced a strategic technology partnership with US-based BroadPak Corporation on November 6 to build advanced semiconductor packaging capabilities in India, anchored by a planned INR62 billion (US$658.77 million) OSAT facility in Madhya Pradesh.
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https://www.digitimes.com/news/a20261109VL209/packaging-plant-subsidiary-technology-incentives.html
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