Surging AI demand turns CoWoS into a headache; securing packaging capacity becomes top priority, says MediaTek deputy GM

Surging demand for advanced packaging driven by artificial intelligence (AI) has turned chip-on-wafer-on-substrate (CoWoS) from an "interesting" technology into a headache, making it an urgent priority for MediaTek to secure wafer, packaging, and substrate capacity, said company deputy GM of advanced packaging Shang Hou.