AI芯片

共 22 篇 · 来自全球主要半导体媒体、研究机构与公司公告

Saras Micro Devices Embeds Capacitors to Power AI Accelerators

A capacitor designed to be built into the PCB or package core supports the vertical power delivery that AI chips need, and a new 2 mm part is sampling…

Semiconductor Digest AI芯片
18 小时前
10-17 22:35

TSMC’s AI Expansion Signals a Broader Shift in Computing

TSMC is describing an artificial intelligence boom that reaches beyond accelerator chips into the wider computing infrastructure needed to support inc…

SemiWiki AI芯片 IntelTSMC
1 天前
10-16 23:00

Siemens and NVIDIA speed up AI chip lithography by 12x

Siemens has expanded its collaboration with NVIDIA to accelerate computational lithography for next-generation AI chips, delivering up to 12x faster f…

EE News Europe EUVAI芯片 NVIDIA
1 天前
10-16 19:45

DEEPX Brings 25-TOPS NPU to Raspberry Pi 5 Edge AI Development

DEEPX and Sixfab enable local vision and language AI on Raspberry Pi 5 using a 3-watt NPU accelerator. The post DEEPX Brings 25-TOPS NPU to Raspberry …

EE Times Asia AI芯片
1 天前
10-16 17:27

Bolt Graphics seeks US$100 million to challenge Nvidia, AMD beyond AI with Zeus GPU

US chip startup Bolt Graphics is seeking approximately US$100 million at a valuation of about US$700 million to develop graphics processors targeting …

DigiTimes AI芯片 NVIDIAAMD
2 天前
10-16 15:20

Samsung, SK Hynix aim to ease AI memory bottlenecks with zHBM, HBF

Samsung Electronics and SK Hynix are developing new memory technologies to address growing bottlenecks in AI systems, with Samsung exploring a design …

DigiTimes 封装存储AI芯片 SamsungSK hynix
2 天前
10-16 14:57

US chipmakers rely more on overseas production than supplier data suggests, SIA finds

The US semiconductor industry sources 95% of its roughly US$27 billion in annual equipment and materials purchases from companies headquartered in the…

DigiTimes AI芯片
2 天前
10-16 12:19

Solving the Edge Computing Energy Problem

With edge AI, the inference has moved from the cloud to the embedded device. Cameras, wearables, industrial sensors, robots, and vehicles can run trai…

Embedded.com AI芯片
2 天前
10-15 21:00

Agentic AI Alters The CPU-GPU Balance

Agentic workloads increase CPU demand, while reasoning models, MoE architectures, and reservoir computing fuel AI acceleration. The post Agentic AI Al…

Semiconductor Engineering AI芯片
3 天前
10-15 15:01

ASML hits record €11.7 billion sales as AI chip demand surges

ASML reported record third-quarter 2026 sales of €11.7 billion ($13.6 billion), up 25% from the previous quarter, as growing demand for AI chips conti…

EE News Europe EUVAI芯片 ASML
3 天前
10-15 13:49

SEMICON West 2026: NVIDIA Expands GPU Libraries for AI-driven Semiconductor Manufacturing

NVIDIA and industry partners are applying accelerated computing and AI agents to chip simulation, process optimization, inspection and fab automation.…

EE Times Asia AI芯片 NVIDIA
3 天前
10-15 10:10

Microchip Unveils PCIe Gen 6 and NVMe Devices for Data Centers

Microchip Technology Inc. has expanded its data center portfolio with new connectivity, storage, and acceleration capabilities designed to meet the pe…

Embedded.com AI芯片
3 天前
10-15 03:23

Designing Edge AI for Real-Time Systems

Bringing AI directly into embedded systems is much more than just running a model on the device. When a decision must come within milliseconds, every …

Embedded.com 存储AI芯片
4 天前
10-14 01:30

Teradyne Launches UltraFLEXplus S Test Platform for Edge AI Chips

New series of testers extend the UltraFLEXplus architecture to deliver superior floor space economics for high-mix, variable-volume manufacturing. The…

Semiconductor Digest AI芯片
5 天前
10-13 03:27

Marvell Introduces Six-Channel CXL 3.2 Memory Expanders

Marvell Technology Inc. has introduced the Structera X 3406 and 3506, second-generation CXL 3.2 memory expansion controllers designed to increase memo…

Embedded.com 存储AI芯片
5 天前
10-13 02:58

GlobalFoundries, TSMC Strike $2B Deal for U.S. AI Chip Packaging Components

Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing…

Semiconductor Digest 封装AI芯片 TSMC
2026-10-09
10-09 05:10

Aehr Expands AI Chip Burn-In Capacity with $6M Hyperscaler Order

Aehr Test Systems, a provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data ce…

Semiconductor Digest AI芯片汽车电子 Intel
2026-10-08
10-08 05:04

Teradyne Integrates Burn-In and System-Level Test for High-Power AI Chips

Chipmakers can lower cost of test, factory floor space, and time to market for high-power AI, automotive, and other high-reliability devices. The post…

Semiconductor Digest AI芯片汽车电子
2026-10-07
10-07 02:24

How OpenAI Used Its Own LLMs to Design Its Jalapeño Chip

On 25 August, OpenAI fully unveiled Jalapeño, the company’s debut AI accelerator chip. Jalapeño delivers up to 13.4 petaflops of 4-bit compute and acc…

IEEE Spectrum · Semiconductors 存储AI芯片 NVIDIA
2026-09-14
09-14 22:06

Samsung and Mistral AI Announce Strategic Partnership for Intelligence-Driven Semiconductor Infrastructure

Samsung Electronics today announced it has entered into a strategic partnership with Mistral AI to enhance its semiconductor engineering and manufactu…

Samsung Newsroom AI芯片 IntelSamsung
2026-09-09
09-09 09:00
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