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共 19 篇 · 来自全球主要半导体媒体、研究机构与公司公告
Exclusive: EnterpriseSG positions Singapore's semiconductor SMEs for bigger roles in global chip supply chains
Singapore is targeting high-value semiconductor manufacturing, advanced packaging, and silicon photonics, building on its strengths in engineering, pr…
10-18 02:39
ASE unveils 18 advanced packaging projects with three universities
ASE, together with National Cheng Kung University (NCKU), National Sun Yat-sen University (NSYSU), and National Chung Cheng University (CCU), unveiled…
10-16 15:26
AI Moves to System-Level Co-Design: How Can Taiwan Capture More Value
During a panel session at iTechCon 2026, discussions explored how Taiwan can build on its strengths in semiconductors, advanced packaging, and system …
10-16 15:18
Samsung, SK Hynix aim to ease AI memory bottlenecks with zHBM, HBF
Samsung Electronics and SK Hynix are developing new memory technologies to address growing bottlenecks in AI systems, with Samsung exploring a design …
10-16 14:57
Analysis: TSMC-GF deal moves mature nodes into AI packaging: What it means for China
As global wafer capacity expands rapidly, TSMC and GlobalFoundries (GF) are highlighting a fast-growing market for mature processes serving advanced a…
10-16 11:53
ZEISS SMT Expands from Lithography Optics into Advanced Packaging Process Control
DUNE corrects wafer bow one wafer at a time, NLX brings X-ray inline, and mask tools get ready for High-NA's larger reticles The post ZEISS SMT Expand…
10-15 23:41
HEIDENHAIN Brings Front-End Motion Control Precision to Advanced Packaging
New ETEL METIS HP air bearing stage uses multi-degree-of-freedom encoders to target maskless lithography and inspection on large panels The post HEIDE…
10-15 23:38
AMBA C2C: Moving Forward With A Converged AMBA Foundation For C2C Connectivity
Extending chiplet connectivity across AXI and CHI with scalable protocol subsets, interoperability, and flexible transport support. The post AMBA C2C:…
10-15 15:02
Characterization of HBM Power Consumption (ETH Zurich, NYU)
Researchers at ETH Zürich and New York University published a technical paper titled “Understanding the Power Consumption of Modern High Bandwidth Mem…
10-15 07:27
SEMI Builds a Global Home for Advanced Packaging
Advanced packaging has a bigger place at SEMICON West than ever, with three days of packaging content on this year’s program, and SEMI is building a g…
10-15 05:49
Eliyan Introduces NuLight Optical Interconnect Chiplets
Nexus and Oscar are Eliyan’s first NuLight chiplet products that enable optical connectivity designed for the high-bandwidth, extended reach, and low-…
10-15 02:43
Fujifilm to Expand CMP Slurry Production Capacity in the U.S.
New production capabilities at the Mesa, Arizona, facility will support growing demand for copper interconnects and advanced packaging applications. T…
10-14 04:02
Nikon Unveils Digital Lithography System for Advanced Semiconductor Packaging
Nikon Corporation will release the DSP-110 digital lithography system for semiconductor advanced packaging in April 2027. The post Nikon Unveils Digit…
10-14 01:38
U.S. Chip Firms Bet Big on R&D
On 12 October, Applied Materials unveiled a multibillion-dollar research facility in Sunnyvale, Calif., in the heart of Silicon Valley . The company f…
10-13 19:00
GlobalFoundries, TSMC Strike $2B Deal for U.S. AI Chip Packaging Components
Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing…
10-09 05:10
Applied Materials, Intel Deepen R&D Collaboration on Transistor Scaling and Advanced Packaging
The collaboration will bring together cutting-edge capabilities from Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oreg…
10-07 02:29
Building Technology People Can Trust
This article is brought to you by Emerson . I’ve spent much of my career as an engineer, including years in the semiconductor industry. And one lesson…
08-24 19:37
The Memory in Your Thumb Drive Could Fix AI’s Big Problem
Large Language Models (LLMs) demand immense amounts of memory, and the more people use them, the more memory is required. Memory makers responded by a…
07-14 21:00
Stacking Chips Sideways Gives AI More Memory
GPUs and other big AI chips just can’t get enough memory. Today’s data center computers stack DRAM 12 dies high. But as memory makers try to build hig…
07-08 18:00