行业资讯
共 635 篇 · 来自全球主要半导体媒体、研究机构与公司公告
Data Orchestration: The Foundation for the Next-generation Semiconductor Enterprise
Data orchestration gives semiconductor engineering teams a practical way to unify disconnected equipment, systems, and data without replacing existing…
10-15 22:00
Powering the Googlebook
MediaTek’s Dimensity CX C10 Max targets Googlebook laptops
10-15 22:00
Dial Up the Cloud: NVIDIA DLSS 4.5 Controls Arrive on GeForce NOW
Dial in the next gaming session this GFN Thursday. New NVIDIA DLSS 4.5 controls give GeForce NOW members more choice over how supported games look and…
10-15 21:00
Solving the Edge Computing Energy Problem
With edge AI, the inference has moved from the cloud to the embedded device. Cameras, wearables, industrial sensors, robots, and vehicles can run trai…
10-15 21:00
Why AI Security Starts at the Chip Level
Artificial intelligence is becoming part of the infrastructure that powers healthcare, transportation, finance, manufacturing, and everyday digital se…
10-15 21:00
HUSB237: The Cost-Effective PD Sink with Just 2 Passives
Discover Hynetek’s HUSB237, a compact USB-PD sink controller enabling firmware-free USB-C upgrades up to 100W with only two external components. The p…
10-15 21:00
Show Daily 2026 — Day Three
View or Download the SEMICON West Show Daily — Day Three! The post Show Daily 2026 — Day Three appeared first on Semiconductor Digest .
10-15 18:57
Small Volumes, Big Impact: Europe’s Hidden Role in Advanced Chipmaking
A Fraunhofer–IMS Nanofabrication partnership illustrates how Europe's low-volume semiconductor manufacturing can support the world's most advanced chi…
10-15 18:54
NVIDIA Expands Advanced Technology Access for Europe’s Scientific Community Through Open Learning Resources, Collaborations and Compute
Much of today’s scientific progress begins with computation. But turning accelerated computing’s potential into scientific progress — modeling climate…
10-15 18:00
Samsung Presents ‘Design Is an Act of Love’ at Seoul Design Week 2026
Samsung Electronics today announced that it is presenting its “Design is an Act of Love” exhibition at Seoul Design Week 2026, taking place in Seoul, …
10-15 18:00
Grid Modernization’s Hidden Cost: A Growing Attack Surface Few Are Watching
Grid modernization is expanding the energy sector’s cyberattack surface, while limited visibility across IT and OT networks leaves connected assets ex…
10-15 16:00
From Smart City to Race Circuit: Samsung’s The Wall in Control Rooms
On the front lines of crisis management, where timely decisions are critical, control rooms are evolving to meet the demands of today’s highly connect…
10-15 16:00
Beyond The Specification: What Really Determines PCIe Retimer Reach?
Multiple interacting factors span silicon design, controller intelligence, channel quality, and the transmission medium itself. The post Beyond The Sp…
10-15 15:07
Strengthening Advanced-Node Interconnects Through Automated Via Insertion
Short-resilient via insertion improves reliability and performance. The post Strengthening Advanced-Node Interconnects Through Automated Via Insertion…
10-15 15:06
Building AI Infrastructure For Greater Choice And Flexibility
Open interfaces and interoperability allow designers to choose technologies based on the needs of the system. The post Building AI Infrastructure For …
10-15 15:03
AMBA C2C: Moving Forward With A Converged AMBA Foundation For C2C Connectivity
Extending chiplet connectivity across AXI and CHI with scalable protocol subsets, interoperability, and flexible transport support. The post AMBA C2C:…
10-15 15:02
Why Open-Weight AI Matters
Proprietary models still hold the edge, but open-weight models add more flexibility for deploying AI. The post Why Open-Weight AI Matters appeared fir…
10-15 15:02
Agentic AI Alters The CPU-GPU Balance
Agentic workloads increase CPU demand, while reasoning models, MoE architectures, and reservoir computing fuel AI acceleration. The post Agentic AI Al…
10-15 15:01
How Close Are We To Fully Autonomous Chip Design?
Synopsys CEO Sassine Ghazi talks about AI agents, the limits of autonomous engineering, digital twins, and the challenges facing 3D-ICs. The post How …
10-15 15:01
Thermal Co-Simulation Testing Of Co-Packaged Optics
Ensuring optical engines can operate reliably alongside high-power AI processors in multi-chip packages. The post Thermal Co-Simulation Testing Of Co-…
10-15 15:01