Winbond approves US$2.2 billion fab expansion, seeks long-term deals with 10 customers

Winbond's board has approved approximately NT$73.1 billion (approx. US$2.23 billion) in capital spending to expand its Kaohsiung wafer fab, as the Taiwanese memory chipmaker prepares to select 10 strategic customers for long-term agreements that would reserve production capacity from 2029 through 2032.