Samsung reportedly plans 2nm fab to boost HBM base-die output

Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth memory (HBM). The fab is estimated to cost KRW25 trillion (approx. US$18.6 billion), with the broader project potentially reaching KRW30 trillion if an existing production line is converted into an advanced packaging facility, Seoul Economic Daily reported on November 4.