Verifying chips is becoming much more difficult in multi-die assemblies. Unlike in the past, when simulation was sufficient, designs now require a combination of simulation, emulation, and FPGA prototyping to ensure that entire systems will work as expected. Purna Mohanty, CEO of SignatureIP, talks about the impact of chiplets and shared memory resources, the challenges of version control across multiple flavors of I/O, and the challenges engineering teams face when hardware-accelerated tools are running at different speeds than the actual design. The post Accelerating Plug-And-Play Prototyping In Chiplet-Based Designs appeared first on Semiconductor Engineering .
Accelerating Plug-And-Play Prototyping In Chiplet-Based Designs
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Shared resources, a mix of tools running at different speeds, and multiple dies are adding new challenges for design teams. The post Accelerating Plug-And-Play Prototyping In Chiplet-Based Designs appeared first on Semiconductor Engineering .
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https://semiengineering.com/accelerating-plug-and-play-prototyping-in-chiplet-based-designs/
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