[News] Intel Claims Industry’s Only High-Volume 300mm InP Silicon Photonics Capability as CPO Gains Momentum

Intel is expanding its silicon photonics capabilities as demand for high-bandwidth optical interconnects grows across AI and high-performance computing (HPC). According to Wccftech, at the 2026 Open Compute Project (OCP) Global Summit, Intel claimed to be the only high-volume foundry capable of supplying 300mm indium phosphide (InP) silicon photonics at scale to the broader industry. The technology is intended to support next-generation near-package optics (NPO) and co-packaged optics (CPO) for AI and HPC applications. As highlighted by ijiwei, conventio...