Advanced Substrate Technologies (AST), a joint venture between TOPPAN Holdings Inc. and Broadcom Inc., has opened a manufacturing facility in Singapore for high-end flip-chip ball grid array (FC-BGA) substrates. It is the first facility of its kind in Singapore and TOPPAN Group’s first outside Japan. Located in the Jurong Lake District, the facility will complement TOPPAN’s main production hub in Niigata, Japan. It is designed to manufacture large-body, high-layer-count substrates used in advanced semiconductor devices, including AI computing and networking chips. “AST’s ability to deliver large-body, high-layer-count substrates at TOPPAN’s exacting standard is helping meet a real bottleneck in AI and networking chip production. We are grateful for the longstanding support and partnership of the Singapore government in this venture. This investment reflects both TOPPAN and Broadcom’s long-term commitment to Singapore as a critical hub in our global manufacturing network and strengthens the resilience of the semiconductor supply chain,” said Yoshiyuki Iida, CEO of AST, in a statement. Construction began in March 2024. AST has since recruited more than 200 engineers and skilled technicians, alongside operational staff. The site also includes R&D capabilities and will work with Singapore technology institutions on future substrate requirements. The approximately 95,000-square-metre plant incorporates solar panels and water-recycling technologies. AST is targeting the start of high-value manufacturing by late 2026, with recruitment continuing across engineering and technical roles. “Singapore continues to be an attractive destination and gateway to the global semiconductor industry for us, especially with a strong ecosystem of innovation, capabilities and resources. TOPPAN looks forward to continuing to drive advanced semiconductor packaging forward as artificial intelligence accelerates across the board,” said Satoshi Oya, President and COO of TOPPAN Holdings. Singapore’s Economic Development Board (EDB) and JTC Corp. supported the project. EDB said the facility would expand the country’s advanced substrate capabilities and create jobs, while JTC highlighted the need for infrastructure to support next-generation semiconductor manufacturing. As TOPPAN’s largest customer for FC-BGA substrates, Broadcom supported the facility’s development to secure additional capacity for its AI computing and networking products. “AST’s FC-BGA substrate capacity in Singapore gives us meaningful flexibility and differentiation as demand for AI and networking silicon continues to climb. This facility, brought online three months early, strengthens our supply chain resilience by delivering vital relief while the industry is constrained by substrate shortages. Thanks to the exceptional execution by TOPPAN and AST, alongside the continued partnership of the Singapore EDB, this facility will deliver the next generation of large-body, high-layer-count substrates that Broadcom requires to further scale global AI infrastructure,” said Charlie Kawwas, President of Broadcom’s Semiconductor Solutions Group, in a press release. AST plans to scale production with TOPPAN and Broadcom as demand for advanced substrates grows across AI, networking and next-generation computing. The post Broadcom-TOPPAN JV Opens Singapore FC-BGA Substrate Facility for AI Chip Production appeared first on EE Times Asia .