Unimicron chairman sees substrate sizes reaching 14x current scale by 2030

TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance computing (HPC) will require more than semiconductor process scaling. Advanced packaging and heterogeneous integration technologies must be introduced in parallel, significantly raising the technical requirements for the PCB and substrate industries.