New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Agentic AI for Heterogeneous System Design Across Chip, Scale-Up, and Scale-Out Domains Argonne National Laboratory , University of Illinois Urbana-Champaign Revealing New Leakage Paths in GAAFETs using Predictive First-Principles Simulations Sandia National Laboratories , Luxembourg Institute of Science and Technology Nanoelectromechanically Gated Gain Cell eDRAM UC Berkeley , Samsung Electronics , Intel A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling Cadence Design Systems , University of Notre Dame Understanding the Power Consumption of Modern High Bandwidth Memory : Experimental Analysis and Modeling Using Real HBM2 DRAM Chips ETH Zürich , New York University Back to the Future: Rethinking EDA Infrastructure for Agentic Systems in Chip Design Verification Columbia University , Google DeepMind , Google Can Autonomous Vehicles Keep Their Cool? A Survey of Thermal Side-Channel and Perception Attacks Missouri University of Science and Technology Find more semiconductor research papers here . The post Chip Industry Technical Paper Roundup: Oct. 20 appeared first on Semiconductor Engineering .