行业资讯
共 461 篇 · 来自全球主要半导体媒体、研究机构与公司公告
NVIDIA Lands in Europe for GTC Berlin
NVIDIA is in Europe, showcasing the future of technology together with the region’s developers, researchers and industry leaders.
10-13 13:13
From Earth to Orbit, France’s Ecosystem Delivers Agentic Computing at Scale With NVIDIA
Companies in France are deploying agentic computing across industries spanning space, financial services, the public sector and scientific research, d…
10-13 13:00
Machines that think: AI in the lab
This is the eighth part in a series on how AI is crossing out of software and into the physical world. This time, Jan Bosch looks at AI-driven discove…
10-13 11:12
Outsourcing wafer handler to VDL ETG fails, ASML takes back full control
Around 2012, key supplier VDL ETG assumed full product responsibility for ASML’s wafer handler. The mission failed.
10-13 11:08
Less spreadsheets, more courage
VDL ETG was capable of pulling off the wafer handler job for ASML, but the willingness to invest simply wasn’t there.
10-13 11:00
10-13 08:00
Applied Materials Unveils $5B EPIC Center in Silicon Valley
$5 billion investment creates the world’s largest semiconductor equipment and process technology R&D facility. The post Applied Materials Unveils $5B …
10-13 05:34
White Knight Introduces Compact Inline Heaters for Semiconductor Processing
White Knight Fluid Handling, a provider of high-purity fluid handling equipment and a Graco company, today announced the launch of its ThermaPoint Com…
10-13 04:56
Semiconductor Leaders to Address AI, Manufacturing and Industry Growth at SEMICON West
Over three days, the program will explore the key forces driving semiconductor growth and transformation. The post Semiconductor Leaders to Address AI…
10-13 04:40
ERS Introduces Automated 310mm Panel-Level Packaging System
ERS electronic today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The post ERS Introduces Automated 310…
10-13 04:36
SUSS Introduces GreenTec Wafer-Cleaning Platform at SEMICON West
SUSS MicroTec SE, a supplier of equipment and process solutions for the semiconductor industry, today announces its entry into the wafer-level cleanin…
10-13 04:33
OTA Firmware Updates: Design-Phase Decisions for Fleet-Wide Success
A failed firmware update that bricks a device is worse than no update at all. Here's how design-phase decisions and build-environment archiving keep O…
10-13 04:32
SEMI and Semiconductor Digest Announce 2026 Best of West Award Finalists
The Best of West Award winner will be announced at SEMICON West 2026 on Thursday, October 15, on the Smart Theater stage located inside the North Expo…
10-13 04:12
Microchip Expands AI Data Center Portfolio with PCIe 6.0 Switch and Storage Upgrades
New connectivity, storage and acceleration solutions help address performance, security and scalability challenges across modern computing architectur…
10-13 03:34
Teradyne Launches UltraFLEXplus S Test Platform for Edge AI Chips
New series of testers extend the UltraFLEXplus architecture to deliver superior floor space economics for high-mix, variable-volume manufacturing. The…
10-13 03:27
Marvell Introduces Six-Channel CXL 3.2 Memory Expanders
Marvell Technology Inc. has introduced the Structera X 3406 and 3506, second-generation CXL 3.2 memory expansion controllers designed to increase memo…
10-13 02:58
A List of Static Analysis Tools
Looking for static analysis tools? Check out this list, which covers open source and commercial licensing.
10-13 02:19
Metal-Foil Current-Sense Resistors Built for Automotive and High-Rel Apps
The AEC-Q200-compliant 0508 and 0612 metal-foil current-sense shunts deliver up to 2-W power density, low TCR, and wide-terminal heat spreading in com…
10-12 23:26
OCP Global Summit: Amid Ecosystem Adoption, NVIDIA Opens Vera Rubin Architecture to Help Scale AI Factories Worldwide
As AI factories grow from megawatts to gigawatts, building them takes more than advanced computing. Open standards are helping the industry scale AI i…
10-12 23:00
NVIDIA and Cisco Introduce New Pluggable Optics Form Factor to Scale AI Factories
NVIDIA and Cisco today announced plans for Ultra-Dense Small Form Factor Pluggable (USFP), a new high-density 400Gb/s-per-lane optical module designed…
10-12 23:00