行业资讯
共 641 篇 · 来自全球主要半导体媒体、研究机构与公司公告
ERS Introduces Automated 310mm Panel-Level Packaging System
ERS electronic today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The post ERS Introduces Automated 310…
10-13 04:36
SUSS Introduces GreenTec Wafer-Cleaning Platform at SEMICON West
SUSS MicroTec SE, a supplier of equipment and process solutions for the semiconductor industry, today announces its entry into the wafer-level cleanin…
10-13 04:33
OTA Firmware Updates: Design-Phase Decisions for Fleet-Wide Success
A failed firmware update that bricks a device is worse than no update at all. Here's how design-phase decisions and build-environment archiving keep O…
10-13 04:32
SEMI and Semiconductor Digest Announce 2026 Best of West Award Finalists
The Best of West Award winner will be announced at SEMICON West 2026 on Thursday, October 15, on the Smart Theater stage located inside the North Expo…
10-13 04:12
Microchip Expands AI Data Center Portfolio with PCIe 6.0 Switch and Storage Upgrades
New connectivity, storage and acceleration solutions help address performance, security and scalability challenges across modern computing architectur…
10-13 03:34
Teradyne Launches UltraFLEXplus S Test Platform for Edge AI Chips
New series of testers extend the UltraFLEXplus architecture to deliver superior floor space economics for high-mix, variable-volume manufacturing. The…
10-13 03:27
Marvell Introduces Six-Channel CXL 3.2 Memory Expanders
Marvell Technology Inc. has introduced the Structera X 3406 and 3506, second-generation CXL 3.2 memory expansion controllers designed to increase memo…
10-13 02:58
A List of Static Analysis Tools
Looking for static analysis tools? Check out this list, which covers open source and commercial licensing.
10-13 02:19
Metal-Foil Current-Sense Resistors Built for Automotive and High-Rel Apps
The AEC-Q200-compliant 0508 and 0612 metal-foil current-sense shunts deliver up to 2-W power density, low TCR, and wide-terminal heat spreading in com…
10-12 23:26
OCP Global Summit: Amid Ecosystem Adoption, NVIDIA Opens Vera Rubin Architecture to Help Scale AI Factories Worldwide
As AI factories grow from megawatts to gigawatts, building them takes more than advanced computing. Open standards are helping the industry scale AI i…
10-12 23:00
NVIDIA and Cisco Introduce New Pluggable Optics Form Factor to Scale AI Factories
NVIDIA and Cisco today announced plans for Ultra-Dense Small Form Factor Pluggable (USFP), a new high-density 400Gb/s-per-lane optical module designed…
10-12 23:00
Solar-Powered Radio Tags Track Monarch Butterflies to Mexico
Project Monarch combines miniature solar-powered radio tags and smartphone detections to trace monarch butterflies across North America.
10-12 21:45
Designing AI Data Center Fabrics with PCIe 6.0 High-Radix Switches
Artificial intelligence is reshaping data center architecture by changing where system bottlenecks occur. For years, networking discussions focused pr…
10-12 21:31
Rapidus Launches CORE Ecosystem to Support 2nm Chip Development and Manufacturing
As part of its first phase, Rapidus announced the formation of Design Solution Associates to help customers support early-stage design for Rapidus’ ad…
10-12 08:22
Infineon Unveils 27 kW Power Supply for Next-Generation AI Servers
Artificial intelligence workloads are redefining the power requirements of modern data centers. The post Infineon Unveils 27 kW Power Supply for Next-…
10-12 08:05
10-12 08:00
Wristwatch-Type Wearable Sensor Enables Real-Time Monitoring of Sodium and Potassium
Researchers report a wristwatch-type design that integrates printed electrodes and wireless electronics for real-time monitoring of sodium and potassi…
10-10 06:06
Microchip Technology Acquires VORAGO Technologies
Microchip Technology Incorporated, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions,…
10-10 04:55
GF Unveils Roadmap to Deliver the World’s Most Advanced FD-SOI Platform for Physical AI
New FDX Fusion platform extends GF’s FD-SOI leadership as the first process technology in Europe to deliver single-digit nanometer digital performance…
10-10 04:31
“Always-On” BMS Electronics Needs a New Approach to Reliability Validation
A white paper from the Global Electronics Association takes a deep dive into why reliability validation of “always-on” BMS electronics requires a smar…
10-10 04:18