Hanmi showcases next-generation equipment, including the Wide TC Bonder, at SEDEX 2026. Credit: DIGITIMES
Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup
South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for HBM4 production and the Wide TC Bonder, scheduled for launch in 2027. The company also introduced five 2.5D packaging systems designed to accommodate increasingly large AI chip packages.
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https://www.digitimes.com/news/a20261019PD215/equipment-packaging-hanmi-ai-chip-hbm.html
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