Figure 1: Space- and Height-Saving Advantages of the DFN1010-3LW Package Compared with SOT-23 ESD diodes in the DFN1010-3LW package provide a compact, low-profile, and high-performance protection solution for next-generation electronic designs. Compared with the traditional SOT-23 package, the DFN1010-3LW package significantly reduces PCB footprint and package height, helping customers save board space and achieve thinner, more compact, and higher-density product designs. The compact package also allows the ESD diode to be placed closer to the connector or protected IC, improving ESD current diversion efficiency while providing greater layout flexibility. In addition, the leadless design helps reduce lead bending and coplanarity-related issues, supporting stable SMT assembly and improved product reliability. Overall, ESD diodes in the DFN1010-3LW package not only serve as a space-saving alternative to SOT-23, but also offer an upgraded protection solution for compact and high-reliability electronic applications. Product Portfolio Scroll left Part Number V WM (V) C J (pF) Max. ESD robustness (IEC61000-4-2) (kV) I PPM at tp = 8/20μs (A) TESDA13VU1052Q3 13 105 30 1.9 TESDA22VU40P2Q3 22 40 4.2 TESDA22VU60P2Q3 22 60 1 TESDA26VU55P2Q3 26 55 0.8 Facebook LinkedIn Email