The Terafab semiconductor manufacturing complex is reportedly targeting a monthly capacity of more than 300,000 wafers for advanced logic chips and approximately 700,000 wafers for memory chips by 2032. That’s roughly equivalent to TSMC’s current 3nm and 2nm production combined and Samsung’s current total DRAM capacity. Speaking at an event last week, Elon Musk put a 1-trillion-dollar price tag on the venture, to be spent in cohorts. High-volume manufacturing is planned to start in the second half of 2028 .