Samtec has expanded its AcceleRate mP connector family with new 10 mm stack-height versions that combine high-speed digital signaling and power delivery in a single board-to-board connector. The UDM6 and UDF6 connectors are designed to reduce PCB space requirements while supporting high current and data rates of up to 64 Gbps PAM4. The development is relevant to European engineers designing compact, high-performance electronics for data centers, wireless infrastructure, industrial automation and aerospace applications. Combining signal and power connections in one footprint could simplify board layouts and help address growing demands for power density and thermal management. High-speed signaling meets power delivery The AcceleRate mP connectors combine signal pins with high-power blades, eliminating the need for separate power connectors and freeing up valuable PCB space. Each power blade supports up to 15 A, with voltage ratings of 200 VAC or 283 VDC. Unlike conventional power connector arrangements, the blades run parallel to the length of the connector body, a 90-degree shift intended to reduce crowding and improve heat dissipation. On the signal side, the high-density open-pin-field array supports data rates of 64 Gbps PAM4 or 32 Gbps NRZ. This architecture gives engineers flexibility to configure single-ended signals, differential pairs and lower-speed power connections within the same connector. Ground connections can also be positioned strategically to minimize crosstalk and manage impedance, helping designers maintain signal integrity in demanding high-speed applications. Flexible configurations for compact designs Samtec offers the AcceleRate mP family in both 5 mm and 10 mm stack heights, providing options for different board spacing requirements. The six-row open-pin-field architecture is available with 60, 120, 180 or 240 signal pins, alongside configurations featuring four, six, eight or ten high-power blades. This flexibility makes the connectors suitable for applications ranging from 5G and emerging 6G infrastructure to robotics, industrial instrumentation, military electronics and aerospace systems. Rugged connectors target space applications The UDM6 and UDF6 connectors have also achieved certification under Samtec’s Severe Environment Testing (SET) program, which evaluates components beyond conventional industry testing requirements. The certification supports their use in demanding environments, including Class D space missions involving low Earth orbit (LEO) satellites, SmallSats and CubeSats. For satellite and aerospace designers, the combination of compact dimensions, high-speed connectivity and rugged-environment qualification offers another option for reducing interconnect complexity without compromising performance. Technical specifications, 3D models and ordering information are available through Samtec’s AcceleRate mP product page . The post Samtec AcceleRate mP connectors cut PCB space appeared first on eeNews Europe .