Robert Bosch GmbH will establish a dedicated Semiconductors division on January 1, 2028, separating its chip operations from the Mobility Electronics division as it seeks to expand sales in automotive, robotics and other technology markets. The new division will remain under Bosch’s Mobility business sector. The restructuring is part of a broader reorganization of the company’s corporate structure and Mobility business, announced in October 2026. Bosch aims to generate approximately €5 billion in semiconductor sales by 2030. It sees growth opportunities beyond its established automotive and consumer electronics markets, particularly in robotics and AI data centers. The company cited estimates that generative AI applications could require an additional annual wafer volume of up to 3.6 million wafers by 2030. Robotics and industrial automation are also expected to increase semiconductor demand, with European demand projected to double by 2040, according to industry analyses. “Semiconductors are the linchpin of our connected world and, at the same time, a key success factor for all of Bosch’s divisions,” Markus Heyn, deputy chairman of the board of management of Bosch and chairman of the Mobility business sector, said in a press statement. Bosch already supplies semiconductors for robotics applications, including chips used to control humanoid robots. It also provides sensor technologies across applications ranging from robotic vacuum cleaners to humanoid systems. The company plans to make more of its manufacturing capacity available to external customers and expand its foundry business. The new organizational structure is intended to align semiconductor operations more closely with customer requirements and the industry’s development cycles. Bosch’s semiconductor portfolio includes MEMS sensors, silicon carbide (SiC) chips, and application-specific integrated circuits (ASICs). Bosch operates approximately 40 semiconductor R&D and manufacturing sites worldwide. Its recent investments include about €3 billion in its wafer fabs in Dresden and Reutlingen, and $2 billion to equip its Roseville, California, facility for specialized SiC chip production. The company also plans to expand its test center in Penang, Malaysia, by the middle of the next decade. Bosch holds a 10% stake in European Semiconductor Manufacturing Co. (ESMC), a joint venture based in Dresden. Under the new structure, the Mobility Electronics division will focus on electronic control units for automotive applications, while semiconductor operations move into the dedicated division. The post Bosch to Establish Dedicated Semiconductor Division in 2028 appeared first on EE Times Asia .