Ceva and Mobilint Bring Physical AI Closer to Everyday Devices

Physical AI is moving closer to everyday reality, and a new collaboration between Ceva and Mobilint offers an encouraging example of how that progress can reach commercial devices. Mobilint’s REGULUS edge AI System-on-Chip brings together Ceva’s SensPro AI DSP and NeuPro-Nano NPU, marking the first production deployment … Read More The post Ceva and Mobilint Bring Physical AI Closer to Everyday Devices appeared first on SemiWiki .