New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Meter-scale quantum interconnects between large quantum processors IBM Research Embodied Emissions of 2.5D and 3D Scaling in Chipletized GPUs for Low-Carbon AI imec , Vrije Universiteit Brussel SecDMP: Provably Secure Data Memory-Dependent Prefetching KU Leuven , EURECOM APPlace: Co-Optimizing Device Locations and Access Points for Routing-Aware Analog Placement UT Austin AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic Packaging Materials Center Leoben , PVA TePla , ASE Superposed analog memory for vector storage in neural networks IBM Research Europe Find more semiconductor research papers here . The post Chip Industry Technical Paper Roundup: Nov. 3 appeared first on Semiconductor Engineering .