AI memory and capacity SK hynix expects memory supply constraints to persist through 2030 , with DRAM and HBM volumes effectively sold out through 2029. Samsung expects tight memory supply through 2028 , citing lengthy fab construction and equipment lead times, larger dies, and greater process complexity in next-gen HBM, as well as a shift of DRAM capacity toward HBM. Samsung said its 2027 HBM supply is already sold out. Solidigm , SK hynix’s U.S. subsidiary, reportedly is discussing a proposed $45B NAND flash fab with the U.S. Commerce Department. China’s CXMT plans to soon begin limited production of HBM3E memory , despite manufacturing yields of just 20% to 30%, per Reuters. Anthropic warned in its IPO filing that HBM shortages and limited TSMC manufacturing capacity could constrain AI expansion. Advanced packaging ASE forecasts a doubling of its advanced-packaging revenue in 2027, and Amkor is ramping new high-density fan-out and 2.5D packaging programs. TSMC reportedly is considering a 20% price increase for CoWoS as AI demand continues to strain advanced-packaging capacity. Applied Materials plans to increase its stake in Besi to ~20%, deepening a strategic partnership that is expanding beyond hybrid bonding into new interconnect architectures and advanced packaging technologies for AI. Manufacturing Intel Foundry reported improving manufacturing execution in Q3, citing better yields and cycle times on 18A. The company also released its 14A 0.9 PDK in October and said it continues to engage prospective external customers around 18A-P and 14A, while advancing its EMIB-T advanced-packaging technology. Infineon plans to invest €1.1B through 2034 at its Villach, Austria facility to establish Europe’s first high-volume manufacturing facility for next-gen GaN power semiconductors on 300mm wafers. UMC approved an additional $3.2B in capital spending to accelerate its capacity expansion in Singapore and Tainan as demand grows for advanced packaging and silicon photonics. Lam Research and imec expanded their collaboration on advanced 3D integration, next-gen memory, and high-NA EUV patterning. The work includes deposition, etch, and plasma dicing processes for advanced packaging, along with Lam’s Aether dry resist technology. AI tools and accelerators Cadence introduced a portfolio of domain-specialized AI models for agentic chip and system design. Integrated with Cadence’s EDA tools, the portfolio spans multiple model sizes and architectures, combining post-trained LLMs, decision models, and self-improving agent skills. Arm introduced a new CPU benchmarking methodology for agentic AI . The framework evaluates CPU performance across agentic workloads, including tool execution, orchestration, and reasoning, using repeatable measurements and end-to-end task outcomes. Google is expanding the reach of its custom AI accelerators, with OpenAI reportedly planning to purchase its TPUs , reports The Information. Separately, Oracle will offer Google’s TPUs through its cloud infrastructure beginning in 2027 and plans to add Arm ’s AGI CPUs in fall 2027. Broadcom ‘s XPUs and networking equipment will support Anthropic ‘s AI infrastructure expansion, beginning in 2027, under a $63B financing arrangement. Meta is expanding deployments of Nvidia and AMD AI infrastructure across its data centers, with both chipmakers also taking stakes in the company. Deals and funding Intel plans to acquire Classiq , a developer of automated quantum algorithm synthesis software. Intel says the acquisition will give it a full stack of quantum offerings, adding to its silicon spin-qubit technology and manufacturing. FuriosaAI raised $620M to scale production of its AI inference accelerator . Unconventional AI plans to acquire NeuReality . Unconfirmed : Marvell is reportedly in advanced talks to acquire optical components maker Lumentum , per Bloomberg. Onsemi reportedly is in talks to acquire Ferric , a startup developing integrated voltage regulators for AI proc