Smaller components and denser boards are creating new thermal challenges for ball grid array (BGA) rework. Miniature passives can be located within a millimeter or two of rework targets. This tightens
Why Shrinking Component Geometries Force a Rethink of BGA Rework Heating Methods
英文
As components shrink to 01005 scale and board densities rise, BGA rework requires more precise heat control. The post Why Shrinking Component Geometries Force a Rethink of BGA Rework Heating Methods appeared first on EE Times .
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