Credit: ACM Research
ACM Shanghai ships first 310×310mm panel-level plating tool as order backlog surges 88%
AI芯片
英文
As AI chip packages continue to grow in size, panel-level packaging equipment is gradually advancing toward customer validation and volume production.
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https://www.digitimes.com/news/a20261030PD208/shanghai-acm-ai-chip-equipment-packaging.html
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