Credit: DIGITIMES
Kinsus explores AlN ceramics beyond glass for AI advanced packaging
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英文
Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass amid ongoing brittleness and reliability challenges, according to R&D vice president Ting-hao Lin at the 2026 TPCA Show.
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https://www.digitimes.com/news/a20261028PD217/packaging-kinsus-substrate-aluminum-materials.html
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