Credit: Goke Microelectronics
Goke Microelectronics raises KGD packaging prices again
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英文
China-based IC design firm Goke Microelectronics will raise prices for its Known Good Die (KGD) packaged products by US$0.5 to US$1.5 per unit from November 2026, depending on capacity. The move marks the second price adjustment known to customers in 2026, as AI-driven memory demand keeps double data rate (DDR) memory supplies tight and pressure spreads to niche memory and integrated packaging products.
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https://www.digitimes.com/news/a20261027PD231/packaging-ic-design-price-ddr-2026.html
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