Simmtech steps up SOCAMM investment as BT substrate supply tightens

Major package substrate makers, including Samsung Electro-Mechanics (Semco), are concentrating capital spending on large, high-layer-count ABF substrates, while capacity expansion for BT substrates used in memory packaging remains limited. With BT substrate supply tightening and demand for low-power SOCAMM memory modules rising, South Korea's Simmtech could benefit from its business in both memory package substrates and module PCBs.