Applied Materials and Besi jointly developed the Kinex integrated die-to-wafer hybrid-bonding system. Credit: Applied Materials
Applied Materials to raise Besi stake to 20% as hybrid-bonding orders surge
Applied Materials
英文
Applied Materials plans to increase its stake in Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) to approximately 20% from 9%, deepening its involvement in advanced chip packaging as demand for hybrid-bonding equipment accelerates.
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https://www.digitimes.com/news/a20261027VL216/applied-materials-equipment-demand-dutch-2025.html
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