High-end ASIC demand drives TGV adoption as TPK weighs further Taiwan expansion

As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via (TGV) technology has emerged as a major focal point for the semiconductor industry due to its ability to enable high-density vertical interconnects and mitigate large-area warpage. TPK Holding is collaborating with a Taiwanese semiconductor packaging giant to co-develop TGV solutions; its pilot line has already begun process of record (POR) adjustments for specific customer specifications, with plans to consider expanding factory investments in Taiwan by 2027.