Credit: DIGITIMES
2nm and CoWoS expansion lifts Chi Yi Hsin Technology backlog to NT$4.5B
The expansion of advanced semiconductor processes and packaging is driving demand for facility engineering, with Chi Yi Hsin Technology securing NT$4.5 billion (US$138.9 million) in orders as it joins the supply chains supporting leading foundry construction projects in Taiwan and the US. Founded in 2014, the facility engineering integrator is preparing to list on the Taipei Exchange to accelerate its entry into the capital markets.
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https://www.digitimes.com/news/a20261021PD257/expansion-packaging-demand-2026-business.html