Amphenol has expanded its data centre connectivity portfolio with high-speed copper and optical interconnects supporting 448 Gb/s signalling and 12.8 Tb/s Ethernet connectivity. The company demonstrated the technologies at OCP Global Summit 2026 in San Jose, alongside PCIe Gen 7 connectors, liquid cooling components and rack-level interconnect solutions. For eeNews Europe readers working on high-speed electronics and AI infrastructure, the developments highlight the increasing demands on signal integrity, connector density and thermal management. The move towards 448G connectivity is particularly relevant as AI systems require faster communication between processors, switches and networking equipment. 448G connectivity for AI computing systems Amphenol’s Sentry HD high-speed backplane connector platform is designed for next-generation 448 Gb/s systems, with an emphasis on signal integrity, density and reliability. The company also demonstrated its XtremePass co-packaged copper (CPC) interconnects , which support configurations ranging from 32 to 128 differential pairs. The technology uses compression-style mating and an optimised ground-return path to reduce insertion loss and crosstalk. Two demonstrations combined XtremePass CPC with Cabled Sentry backplane and Front I/O OverPass technologies, showing potential approaches for high-speed connections within AI computing systems. The Front I/O demonstration also included a 448G-capable test fixture developed by Amphenol’s Wilder Technologies team for host debugging and compliance testing. Optical interconnects reach 12.8 Tb/s For optical networking, Amphenol presented its XPO-LPO transceiver , supporting 12.8 Tb/s Ethernet connectivity at 224 Gb/s per lane. The liquid-cooled module has a specified power consumption of 80 W and supports XPO/OIF-CMIS compliance. The associated XPO OverPass assembly connects optical transceivers to chips or backplanes, with 30/32 AWG cable options and a claimed fourfold increase in front-panel I/O density. Other technologies on display included the Celerity 224 Gb/s mezzanine connector, Titen connectors supporting PCIe Gen 7, and ExtremePort OSFP-XD connectors designed for PCIe Gen 6 and 112G PAM4 applications. Rack-level connectivity and cooling Amphenol also demonstrated an OCP ORv3 rack incorporating high-speed interconnects for scale-up and scale-out AI architectures. Among the developments were Cable Backplane Cartridges, which replace rigid PCB backplanes with structured cable assemblies. These allow compute and switching equipment to be interconnected across chassis boundaries within a rack. The company also highlighted expanded-beam optics and FastSelfClean connector technology, intended to improve optical connection reliability in environments where contamination can affect performance. The post Amphenol showcases 448G connectivity for AI data centers appeared first on eeNews Europe .