BizLink is expanding its AI data centre interconnect portfolio with 800 VDC power distribution , high-speed copper and optical connectivity, and liquid-cooling solutions. The company presented the technologies at OCP Global Summit 2026 , alongside precision interconnect and mechanical solutions from its Interplex business. For eeNews Europe readers working on data centre power electronics and high-speed networking, the portfolio highlights how AI data centre connectivity is evolving to accommodate higher rack power densities, faster data transmission and more demanding thermal management requirements. 800 VDC power distribution for AI racks BizLink’s power portfolio includes 800 VDC and 400 VDC interconnect solutions designed for OCP and NVIDIA MGX rack architectures. The company is also developing liquid-cooled integrated power solutions and specialised interconnect designs for next-generation power and compute racks. These technologies are intended to support power distribution in high-density AI installations, where increasing compute capacity places greater demands on electrical connections and thermal management. The move towards higher-voltage DC distribution is particularly relevant for large AI clusters, as it can reduce current requirements for a given power level and help limit resistive losses. High-speed copper and 1.6T optical connectivity On the data connectivity side, BizLink showcased PCIe Gen6 DA-CEM, EDSFF Hybrid and MCIO-AC cable assemblies for AI servers and networking equipment. The portfolio also includes 448G bulk cable and 1.6T connectivity solutions intended to support increasing bandwidth requirements across AI computing platforms. For optical networking, BizLink presented co-packaged optics (CPO), 800G/1.6T and XPO optical transceiver interconnect solutions. These incorporate fiber array units (FAUs), SN-MT/MMC multi-fiber connectivity, optical shuffle assemblies and fanout fiber connections, supporting high-density optical architectures for 1.6T and beyond. Liquid cooling and rack monitoring BizLink is also extending its portfolio into thermal management with liquid-cooled OSFP cages designed for next-generation 1.6T network switches. The company is combining these with Rack Management Controllers (RMCs) and daisy-chain leak detection featuring node identification. The modular monitoring architecture is intended to simplify maintenance and improve fault identification in liquid-cooled rack installations. “The continued growth of AI infrastructure is driving greater demand for reliable connectivity across high-density data center environments,” said Eric Wu, Vice President and Head of the HPC Business Unit at BizLink. “Interplex brings high-precision interconnect and custom mechanical expertise to support complex data center design and manufacturing requirements. With system integration expertise and a comprehensive interconnect portfolio, BizLink helps customers accelerate AI infrastructure deployment.” The post BizLink expands 800 VDC power and 1.6T connectivity for AI data centers appeared first on eeNews Europe .