Credit: DIGITIMES
AUO selects glass substrate specs for semiconductor processes, not size rivalry
英文
AUO is tailoring its glass core substrate specifications specifically to semiconductor process requirements rather than competing on panel dimensions with Innolux, according to Chairman and CEO Paul Peng. The company aims to leverage its glass-processing expertise to supply critical components and technologies to outsourced semiconductor assembly and test (OSAT) leaders such as ASE Technology Holding and Powertech Technology.
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https://www.digitimes.com/news/a20261020PD237/auo-substrate-lcd-packaging-osat.html
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